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Polymer Based Dual Damascene Process for Fine Pitch RDL Adv..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Hsiang-Yao, Hsiao ; Ley, Ryan ; Suo, Peng.. - p. 391-395 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457887