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1 Ergebnisse
1
Experimental Investigations on Thermal Superposition Effect..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Ye, Yuxin
;
Du, Xiangbin
;
Kong, Yanmei
... - p. 1017-1021 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457888
RT T1 <cTitle>2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Experimental Investigations on Thermal Superposition Effect by Embedded Manifold Cooling</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10457888&Exemplar=1&LAN=DE A1 Ye, Yuxin A1 Du, Xiangbin A1 Kong, Yanmei A1 Liu, Ruiwen A1 Yun, Shichang A1 Jia, Shiqi A1 Li, Wei A1 Lv, Xiaorui A1 Lin, Pengrong A1 Wang, Zhiqiang A1 Jiao, Binbin YR 2023 K1 Manifolds K1 Couplings K1 Temperature measurement K1 Cooling K1 Thermal resistance K1 Electronic packaging thermal management K1 Thermal management SP 1017 OP 1021 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457888 DO https://doi.org/10.1109/EPTC59621.2023.10457888 SF ELIB - SuUB Bremen
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