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1 Ergebnisse
1
Eliminating Preferred Orientation and Refining Grain Size w..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Chen, Zi-Xu
;
Chao, Chen-Sung
;
Duh, Jenq-Gong
- p. 464-468 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457890
RT T1
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
: T1
Eliminating Preferred Orientation and Refining Grain Size with Ni Doping in Cu/Sn-3.0Ag-0.5Cu/Cu TLP Bonding under Isothermal Aging Treatment
UL https://suche.suub.uni-bremen.de/peid=ieee-10457890&Exemplar=1&LAN=DE A1 Chen, Zi-Xu A1 Chao, Chen-Sung A1 Duh, Jenq-Gong YR 2023 K1 Liquids K1 Stacking K1 Morphology K1 Aging K1 Nickel K1 Reliability K1 Microstructure SP 464 OP 468 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457890 DO https://doi.org/10.1109/EPTC59621.2023.10457890 SF ELIB - SuUB Bremen
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