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Integrated heat management in the reticle masking module on..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Loktev, M. Y. ; de Boeij, J. ; Misat, S. I.. - p. 1047-1052s , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457891