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Polymer Dielectric Materials Evaluation for Hybrid Bonding ..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Sekhar, Vasarla Nagendra ; Fujiwara, Takenori ; Araki, Hitoshi... - p. 216-220 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457892