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1 Ergebnisse
1
Insulated, Passivated & Adhesively-Promoted Bonding Wire us..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Park, Soojae
;
Jeong, Hwajin
;
Choi, Kyujung
. - p. 1108-1114 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457901
RT T1 <cTitle>2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Insulated, Passivated & Adhesively-Promoted Bonding Wire using Al2O3 Nano Coating</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10457901&Exemplar=1&LAN=DE A1 Park, Soojae A1 Jeong, Hwajin A1 Choi, Kyujung A1 Min, Eulgi YR 2023 K1 Encapsulation K1 Gold K1 Adhesives K1 Wires K1 Random access memory K1 Coatings K1 Reliability K1 Insulated Wire K1 Adhesively-Promoted Wire K1 Passivated Wire K1 Al2O3 Coating K1 Bonding Wire K1 Nano Ceramic SP 1108 OP 1114 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457901 DO https://doi.org/10.1109/EPTC59621.2023.10457901 SF ELIB - SuUB Bremen
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