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Study on board-level reliability of passive components on u..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Lv, Xiang ; Shi, Hongbin ; Li, Mengyuan.. - p. 57-62 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457904