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Defect evolution during through-silicon via copper electrop..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Van Nhat Anh, Tran ; Venkataraman, Nandini ; Tao, Meng... - p. 1059-1062 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457912