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Analysis of the influences of PCB process tolerances and as..:
, In:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
,
Tschoban, Christian
;
Potter, Harald
;
Becker, Lukas
... - p. 266-272 , 2023
Link:
https://doi.org/10.1109/EPTC59621.2023.10457917
RT T1 <cTitle>2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Analysis of the influences of PCB process tolerances and assembly tolerances on 60 GHz radar sensor for Radar toolkit</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10457917&Exemplar=1&LAN=DE A1 Tschoban, Christian A1 Potter, Harald A1 Becker, Lukas A1 Perlwitz, Paul A1 Brockmann, Carsten A1 Gros, Mike A1 Ndip, Ivan A1 Schneider-Ramelow, Martin YR 2023 K1 Manufacturing processes K1 Design methodology K1 Printed circuits K1 Process control K1 Radar K1 Manufacturing K1 Surface finishing SP 266 OP 272 LK http://dx.doi.org/https://doi.org/10.1109/EPTC59621.2023.10457917 DO https://doi.org/10.1109/EPTC59621.2023.10457917 SF ELIB - SuUB Bremen
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