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Pressure-less Copper Sintering Paste for Die Attach Applica..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Yao, Min ; Han, Xuelian ; Li, Hongyun... - p. 507-511 , 2023
Link: https://doi.org/10.1109/EPTC59621.2023.10457920