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1 Ergebnisse
1
The effects of via materials on the scattering matrix and r..:
, In:
IET International Conference on Engineering Technologies and Applications (ICETA 2023)
,
Chung, S. S. M.
;
Tuan, S. -C.
- p. None , 2023
Link:
https://doi.org/10.1049/icp.2023.3198
RT T1 <cTitle>IET International Conference on Engineering Technologies and Applications (ICETA 2023)</cTitle>: T1 <Title>The effects of via materials on the scattering matrix and radiation pattern of substrate integrated waveguide antenna</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10461205&Exemplar=1&LAN=DE A1 Chung, S. S. M. A1 Tuan, S. -C. YR 2023 SP None LK http://dx.doi.org/https://doi.org/10.1049/icp.2023.3198 DO https://doi.org/10.1049/icp.2023.3198 SF ELIB - SuUB Bremen
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