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1 Ergebnisse
1
Signal integrity aspect of High Speed Interface Routing in ..:
, In:
2023 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON)
,
Sankaran, N Sabari Siva
;
Kumar, A Suresh
;
Durairaj, Muthukumaran
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/MAPCON58678.2023.10463958
RT T1
2023 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON)
: T1
Signal integrity aspect of High Speed Interface Routing in multilayered PCB environment
UL https://suche.suub.uni-bremen.de/peid=ieee-10463958&Exemplar=1&LAN=DE A1 Sankaran, N Sabari Siva A1 Kumar, A Suresh A1 Durairaj, Muthukumaran A1 Murugan, R Bharatha A1 Tiwari, Nilesh K A1 Gupta, Ashish YR 2023 K1 Three-dimensional displays K1 Systematics K1 Numerical analysis K1 Insertion loss K1 Routing K1 Propagation losses K1 Nonhomogeneous media K1 Channel quality K1 cost K1 high density board K1 High speed interface K1 signal integrity K1 USB4 SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/MAPCON58678.2023.10463958 DO https://doi.org/10.1109/MAPCON58678.2023.10463958 SF ELIB - SuUB Bremen
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