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1 Ergebnisse
1
The Significance of Thermal-Aware Universal Chiplet Interco..:
, In:
2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
,
Son, Keeyoung
;
Kim, Keunwoo
;
Choi, Seonguk
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/EDAPS58880.2023.10468234
RT T1 <cTitle>2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)</cTitle>: T1 <Title>The Significance of Thermal-Aware Universal Chiplet Interconnect Express (UCIe) Interface Design in 2.5D/3D ICs</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10468234&Exemplar=1&LAN=DE A1 Son, Keeyoung A1 Kim, Keunwoo A1 Choi, Seonguk A1 Yoon, Jiwon A1 Kim, Jihun A1 Hong, Jonghyun A1 Kim, Hyunwoo A1 Lee, Junghyun A1 Kim, Joungho YR 2023 SN 2151-1233 K1 Temperature K1 Power demand K1 Crosstalk K1 Transfer functions K1 Voltage K1 Packaging K1 Thermal management K1 Advanced package K1 Chiplet K1 Thermal-aware K1 Universal chiplet interconnect express (UCIe) SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EDAPS58880.2023.10468234 DO https://doi.org/10.1109/EDAPS58880.2023.10468234 SF ELIB - SuUB Bremen
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