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1 Ergebnisse
1
Signal Integrity Design and Analysis of Universal Chiplet I..:
, In:
2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
,
Shin, Taein
;
Kim, Keunwoo
;
Park, Hyunwook
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/EDAPS58880.2023.10468369
RT T1 <cTitle>2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)</cTitle>: T1 <Title>Signal Integrity Design and Analysis of Universal Chiplet Interconnect Express (UCIe) Channel in Silicon Interposer for Advanced Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10468369&Exemplar=1&LAN=DE A1 Shin, Taein A1 Kim, Keunwoo A1 Park, Hyunwook A1 Sim, Boogyo A1 Kim, Seongguk A1 Kim, Jihun A1 Choi, Seonguk A1 Park, Joonsang A1 Song, Jinwook A1 Kim, Jaehyup A1 Park, Joung Won A1 Kang, Daehyun A1 Kim, Joungho YR 2023 SN 2151-1233 K1 Frequency-domain analysis K1 Crosstalk K1 Transfer functions K1 Metals K1 Voltage K1 Packaging K1 Routing K1 Advanced package K1 Signal integrity K1 Silicon interposer K1 Universal chiplet interconnect express SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EDAPS58880.2023.10468369 DO https://doi.org/10.1109/EDAPS58880.2023.10468369 SF ELIB - SuUB Bremen
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