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1 Ergebnisse
1
Space Mapped Neuromodeling for Fast & Accurate Signal Integ..:
, In:
2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
,
Kushwaha, Suyash
;
Guglani, Surila
;
Soleimani, Nastaran
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/EDAPS58880.2023.10468464
RT T1
2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
: T1
Space Mapped Neuromodeling for Fast & Accurate Signal Integrity Analysis of Rough On-chip Copper Interconnects
UL https://suche.suub.uni-bremen.de/peid=ieee-10468464&Exemplar=1&LAN=DE A1 Kushwaha, Suyash A1 Guglani, Surila A1 Soleimani, Nastaran A1 Pathania, Sunil A1 Kumar, Somesh A1 Trinchero, Riccardo A1 Roy, Sourajeet A1 Sharma, Rohit YR 2023 SN 2151-1233 K1 Training K1 Surface waves K1 Artificial neural networks K1 Packaging K1 Surface roughness K1 System-on-chip K1 Rough surfaces K1 Artificial neural network (ANN) K1 on-chip interconnects K1 surface roughness K1 signal integrity SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EDAPS58880.2023.10468464 DO https://doi.org/10.1109/EDAPS58880.2023.10468464 SF ELIB - SuUB Bremen
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