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1 Ergebnisse
1
ISOP-Yield: Yield-Aware Stack-Up Optimization for Advanced ..:
, In:
2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC)
,
Chae, Hyunsu
;
Zhu, Keren
;
Mutnury, Bhyrav
... - p. 644-650 , 2024
Link:
https://doi.org/10.1109/ASP-DAC58780.2024.10473886
RT T1 <cTitle>2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC)</cTitle>: T1 <Title>ISOP-Yield: Yield-Aware Stack-Up Optimization for Advanced Package using Machine Learning</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10473886&Exemplar=1&LAN=DE A1 Chae, Hyunsu A1 Zhu, Keren A1 Mutnury, Bhyrav A1 Jiang, Zixuan A1 De Araujo, Daniel A1 Wallace, Douglas A1 Winterberg, Douglas A1 Klivans, Adam A1 Pan, David Z. YR 2024 SN 2153-697X K1 Machine learning algorithms K1 Printed circuits K1 Integrated circuit interconnections K1 Machine learning K1 Packaging K1 Approximation algorithms K1 Taylor series SP 644 OP 650 LK http://dx.doi.org/https://doi.org/10.1109/ASP-DAC58780.2024.10473886 DO https://doi.org/10.1109/ASP-DAC58780.2024.10473886 SF ELIB - SuUB Bremen
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