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Enhancing Electrical and Physical Properties of Epoxy Resin..:
, In:
2024 28th International Conference on Information Technology (IT)
,
Eid, Eid J.
;
Hossam-Eldin, Ahmed
;
Eldeen, Loai S.
. - p. 1-6 , 2024
Link:
https://doi.org/10.1109/IT61232.2024.10475757
RT T1 <cTitle>2024 28th International Conference on Information Technology (IT)</cTitle>: T1 <Title>Enhancing Electrical and Physical Properties of Epoxy Resin by Incorporating SiO₂ Nano Filler</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10475757&Exemplar=1&LAN=DE A1 Eid, Eid J. A1 Hossam-Eldin, Ahmed A1 Eldeen, Loai S. A1 Kotb, Hossam YR 2024 SN 2836-3744 K1 Silicon compounds K1 Insulation K1 Nanocomposites K1 Epoxy resins K1 High-voltage techniques K1 Flashover K1 Filling SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/IT61232.2024.10475757 DO https://doi.org/10.1109/IT61232.2024.10475757 SF ELIB - SuUB Bremen
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