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1 Ergebnisse
1
Ruthenium Metallization and Via Prefill for Electromigratio..:
, In:
2023 IEEE International Integrated Reliability Workshop (IIRW)
,
Esposto, Simone
;
Sisto, Giuliano
;
Ciofi, Ivan
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/IIRW59383.2023.10477701
RT T1 <cTitle>2023 IEEE International Integrated Reliability Workshop (IIRW)</cTitle>: T1 <Title>Ruthenium Metallization and Via Prefill for Electromigration Reliability Enhancement in Advanced Sub-3 nm Node Interconnects</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10477701&Exemplar=1&LAN=DE A1 Esposto, Simone A1 Sisto, Giuliano A1 Ciofi, Ivan A1 Milojevic, Dragomir A1 Croes, Kristof A1 Zahedmanesh, Houman YR 2023 SN 2374-8036 K1 Electromigration K1 Metallization K1 Ruthenium K1 Sociology K1 Integrated circuit interconnections K1 Probability K1 Reliability engineering K1 Electromigration (EM) K1 copper K1 ruthenium K1 via prefill K1 statistical electromigration budgeting (SEB) SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IIRW59383.2023.10477701 DO https://doi.org/10.1109/IIRW59383.2023.10477701 SF ELIB - SuUB Bremen
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