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1 Ergebnisse
1
Integrated Process-Mechanical Stress Analysis of 2.5D/3D IC..:
, In:
2023 IEEE International Integrated Reliability Workshop (IIRW)
,
Ren, Bo
;
Wu, C. T.
;
Hu, Wei
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/IIRW59383.2023.10477702
RT T1 <cTitle>2023 IEEE International Integrated Reliability Workshop (IIRW)</cTitle>: T1 <Title>Integrated Process-Mechanical Stress Analysis of 2.5D/3D ICs with Two Types of Interconnections in Advanced Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10477702&Exemplar=1&LAN=DE A1 Ren, Bo A1 Wu, C. T. A1 Hu, Wei A1 Pan, Xiaofei A1 Lyu, Dandan A1 Chang, Norman YR 2023 SN 2374-8036 K1 Semiconductor device modeling K1 Thermomechanical processes K1 Thermal engineering K1 Packaging K1 Thermal management K1 Reliability engineering K1 Bonding K1 Solder ball K1 Solder bump K1 Cu/Cu direct bonding K1 Integrated simulation K1 Stress analysis K1 Reliability K1 2.5D/3D SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IIRW59383.2023.10477702 DO https://doi.org/10.1109/IIRW59383.2023.10477702 SF ELIB - SuUB Bremen
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