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1 Ergebnisse
1
In-Package Characterization of Dielectrics Using Ring Reson..:
, In:
2024 15th German Microwave Conference (GeMiC)
,
Stadler, Pascal
;
Braun, Tobias T.
;
Geissler, Christian
... - p. 272-275 , 2024
Link:
https://doi.org/10.23919/GeMiC59120.2024.10485307
RT T1
2024 15th German Microwave Conference (GeMiC)
: T1
In-Package Characterization of Dielectrics Using Ring Resonators and Adaptive 3D EM-Simulations Around 77 GHz
UL https://suche.suub.uni-bremen.de/peid=ieee-10485307&Exemplar=1&LAN=DE A1 Stadler, Pascal A1 Braun, Tobias T. A1 Geissler, Christian A1 Scheibe, Philipp A1 Braun, Tanja A1 Holck, Ole A1 Romstadt, Justin A1 Pohl, Nils YR 2024 K1 Microwave measurement K1 Solid modeling K1 Three-dimensional displays K1 Permittivity measurement K1 Resonant frequency K1 Packaging K1 Dielectrics K1 Dielectric Measurement K1 Permittivity K1 Loss Tangent K1 Dielectric Resonator K1 Ring Resonator K1 eWLB K1 RDL-first SP 272 OP 275 LK http://dx.doi.org/https://doi.org/10.23919/GeMiC59120.2024.10485307 DO https://doi.org/10.23919/GeMiC59120.2024.10485307 SF ELIB - SuUB Bremen
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