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1 Ergebnisse
1
Effect of potting on the solder joint reliability of QFN pa..:
, In:
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Nawghane, Chinmay
;
Vandevelde, Bart
;
Vanderstraeten, Daniel
.. - p. 1-6 , 2024
Link:
https://doi.org/10.1109/EuroSimE60745.2024.10491410
RT T1
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
: T1
Effect of potting on the solder joint reliability of QFN packages under thermal cycling load
UL https://suche.suub.uni-bremen.de/peid=ieee-10491410&Exemplar=1&LAN=DE A1 Nawghane, Chinmay A1 Vandevelde, Bart A1 Vanderstraeten, Daniel A1 Haspeslagh, Harold A1 Nauwelaerts, Thomas YR 2024 SN 2833-8596 K1 Temperature dependence K1 Thermomechanical processes K1 Materials reliability K1 Fatigue K1 Thermal conductivity K1 Electronic packaging thermal management K1 Thermal loading SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE60745.2024.10491410 DO https://doi.org/10.1109/EuroSimE60745.2024.10491410 SF ELIB - SuUB Bremen
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