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1 Ergebnisse
1
Multi-parameters optimization for electromigration in WLCSP..:
, In:
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Du, Leiming
;
Deng, Shanliang
;
Cui, Zhen
... - p. 1-4 , 2024
Link:
https://doi.org/10.1109/EuroSimE60745.2024.10491411
RT T1 <cTitle>2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Multi-parameters optimization for electromigration in WLCSP solder bumps</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10491411&Exemplar=1&LAN=DE A1 Du, Leiming A1 Deng, Shanliang A1 Cui, Zhen A1 Poelma, Rene A1 Beelen-Hendrikx, Caroline A1 Zhang, Kouchi YR 2024 SN 2833-8596 K1 Temperature sensors K1 Electromigration K1 Temperature K1 Sensitivity analysis K1 Loading K1 Software K1 Numerical models SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE60745.2024.10491411 DO https://doi.org/10.1109/EuroSimE60745.2024.10491411 SF ELIB - SuUB Bremen
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