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1 Ergebnisse
1
Sensitivity Study of Wafer-Level Packaging Lifetime Predict..:
, In:
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Lee, C. E.
;
Yuan, Cadmus
;
Chiang, K. N.
- p. 1-5 , 2024
Link:
https://doi.org/10.1109/EuroSimE60745.2024.10491421
RT T1 <cTitle>2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Sensitivity Study of Wafer-Level Packaging Lifetime Prediction Using Different Creep Constitutive Equations</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10491421&Exemplar=1&LAN=DE A1 Lee, C. E. A1 Yuan, Cadmus A1 Chiang, K. N. YR 2024 SN 2833-8596 K1 Semiconductor device modeling K1 Analytical models K1 Creep K1 Predictive models K1 Mathematical models K1 Finite element analysis K1 Wafer scale integration K1 Wafer Level Packaging K1 Accelerated Thermal Cycling Test K1 Finite Element Analysis K1 Garofalo Hyperbolic Sine model K1 Anand model K1 energy density method SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE60745.2024.10491421 DO https://doi.org/10.1109/EuroSimE60745.2024.10491421 SF ELIB - SuUB Bremen
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