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Sintering Mechanism Analysis of Cu Nanoparticles via Molecu..:
, In:
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Hou, Fengze
;
Ge, Honglin
;
Sun, Zhanxing
... - p. 1-6 , 2024
Link:
https://doi.org/10.1109/EuroSimE60745.2024.10491437
RT T1 <cTitle>2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Sintering Mechanism Analysis of Cu Nanoparticles via Molecular Dynamics</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10491437&Exemplar=1&LAN=DE A1 Hou, Fengze A1 Ge, Honglin A1 Sun, Zhanxing A1 Zhou, Yunyan A1 You, Xiangan A1 Su, Meiying A1 Chen, Chuan A1 Wang, Qidong A1 Cao, Liqiang YR 2024 SN 2833-8596 K1 Vibrations K1 Nanoparticles K1 Analytical models K1 Temperature K1 Dynamics K1 Sintering K1 Atoms K1 MD K1 Cu NPs K1 sintering K1 temperature K1 pressure SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE60745.2024.10491437 DO https://doi.org/10.1109/EuroSimE60745.2024.10491437 SF ELIB - SuUB Bremen
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