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1 Ergebnisse
1
Investigating the Sintering Process and Mechanical Properti..:
, In:
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Liu, Xu
;
Hu, Dong
;
Li, Zichuan
... - p. 1-7 , 2024
Link:
https://doi.org/10.1109/EuroSimE60745.2024.10491446
RT T1 <cTitle>2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10491446&Exemplar=1&LAN=DE A1 Liu, Xu A1 Hu, Dong A1 Li, Zichuan A1 Fan, Xuejun A1 Zhang, Guoqi A1 Fan, Jiajie YR 2024 SN 2833-8596 K1 Micromechanical devices K1 Temperature K1 Photonic band gap K1 Stacking K1 Sintering K1 Packaging K1 Neck K1 Nano-copper sintering K1 molecular dynamics simulation K1 particle packing model K1 tensile simulation SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE60745.2024.10491446 DO https://doi.org/10.1109/EuroSimE60745.2024.10491446 SF ELIB - SuUB Bremen
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