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Warpage Estimation of Panel-Level Packaging by AI-assisted ..:
, In:
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Chen, Y.C.
;
Chiang, K.N.
- p. 1-5 , 2024
Link:
https://doi.org/10.1109/EuroSimE60745.2024.10491469
RT T1 <cTitle>2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Warpage Estimation of Panel-Level Packaging by AI-assisted Design on Simulation</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10491469&Exemplar=1&LAN=DE A1 Chen, Y.C. A1 Chiang, K.N. YR 2024 SN 2833-8596 K1 Micromechanical devices K1 Thermal expansion K1 Mass production K1 Process modeling K1 Production K1 Packaging K1 Finite element analysis SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE60745.2024.10491469 DO https://doi.org/10.1109/EuroSimE60745.2024.10491469 SF ELIB - SuUB Bremen
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