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1 Ergebnisse
1
Application of Digital Image Correlation (DIC) for deformat..:
, In:
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Maus, I.
;
Niessner, M.
;
Zhang, M.
... - p. 1-6 , 2024
Link:
https://doi.org/10.1109/EuroSimE60745.2024.10491472
RT T1
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
: T1
Application of Digital Image Correlation (DIC) for deformation measurement of fan-out Wafer Level Package mounted on Printed Circuit Board
UL https://suche.suub.uni-bremen.de/peid=ieee-10491472&Exemplar=1&LAN=DE A1 Maus, I. A1 Niessner, M. A1 Zhang, M. A1 Hartner, W. A1 Seiler, B. A1 Altieri-Weimar, P. YR 2024 SN 2833-8596 K1 Temperature measurement K1 Deformation K1 Printed circuits K1 Strain measurement K1 Fatigue K1 Time measurement K1 Copper K1 DIC K1 WLP K1 FO-WLP K1 RF laminates K1 HF layer K1 SAC K1 TCoB K1 Reliability K1 SJF K1 Bismuth doping K1 FEA K1 solder joint reliability simulation K1 CTE SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE60745.2024.10491472 DO https://doi.org/10.1109/EuroSimE60745.2024.10491472 SF ELIB - SuUB Bremen
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