I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Solder Fatigue Analyses and Predictions for PCB Mounted Com..:
, In:
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Dudek, Rainer
;
Doring, Ralf
;
Kreysig, Kerstin
... - p. 1-13 , 2024
Link:
https://doi.org/10.1109/EuroSimE60745.2024.10491474
RT T1 <cTitle>2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Solder Fatigue Analyses and Predictions for PCB Mounted Components after Thirteen Years of Thermal Field Cycling</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10491474&Exemplar=1&LAN=DE A1 Dudek, Rainer A1 Doring, Ralf A1 Kreysig, Kerstin A1 Rzepka, Sven A1 Fruehauf, Peter A1 Weigert, Andreas YR 2024 SN 2833-8596 K1 Micromechanical devices K1 Creep K1 Predictive models K1 Fatigue K1 Thermal analysis K1 Microelectronics K1 Thermal loading SP 1 OP 13 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE60745.2024.10491474 DO https://doi.org/10.1109/EuroSimE60745.2024.10491474 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
