Merkliste 
 1 Ergebnisse 
 
1

Enhancing the Reliability of Power Packages Combining SiC a..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Mach, A. Von ; Ananiev, S. ; Heinrich, A.... - p. 1-5 , 2024