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Enhancing the Reliability of Power Packages Combining SiC a..:
, In:
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Mach, A. Von
;
Ananiev, S.
;
Heinrich, A.
... - p. 1-5 , 2024
Link:
https://doi.org/10.1109/EuroSimE60745.2024.10491486
RT T1 <cTitle>2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Enhancing the Reliability of Power Packages Combining SiC and Diffusion Solder Die Attach Technologies</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10491486&Exemplar=1&LAN=DE A1 Mach, A. Von A1 Ananiev, S. A1 Heinrich, A. A1 Gumbrecht, T. A1 Altieri-Weimar, P. A1 Cordill, M. A1 Eckert, J. YR 2024 SN 2833-8596 K1 Temperature measurement K1 Temperature dependence K1 Semiconductor device measurement K1 Temperature K1 Silicon carbide K1 Reliability K1 Stress SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE60745.2024.10491486 DO https://doi.org/10.1109/EuroSimE60745.2024.10491486 SF ELIB - SuUB Bremen
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