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A comprehensive methodology for criticality assessment of m..:
, In:
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Kamble, Vikram G
;
Patel, Dhaval Rasheshkumar
;
Schipfer, Christian
... - p. 1-7 , 2024
Link:
https://doi.org/10.1109/EuroSimE60745.2024.10491487
RT T1
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
: T1
A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies
UL https://suche.suub.uni-bremen.de/peid=ieee-10491487&Exemplar=1&LAN=DE A1 Kamble, Vikram G A1 Patel, Dhaval Rasheshkumar A1 Schipfer, Christian A1 Thalhamer, Andreas A1 Zuendel, Julia A1 Krivec, Thomas A1 Antretter, Thomas A1 Fuchs, Peter Filipp YR 2024 SN 2833-8596 K1 Performance evaluation K1 Technological innovation K1 Printed circuits K1 Thermomechanical processes K1 Microelectronics K1 Finite element analysis K1 Sustainable development K1 Via K1 Microvia K1 Printed Circuit Board Assembly (PCBA) K1 Criticality Assessment K1 Reliability K1 Finite Element Analysis (FEA) SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE60745.2024.10491487 DO https://doi.org/10.1109/EuroSimE60745.2024.10491487 SF ELIB - SuUB Bremen
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