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Full-Field Through-Chip IR-Thermography-based Quality Testi..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),

May, D. ; Wunderle, B. ; Cirulis, I.... - p. 1-8 , 2024

Link: https://doi.org/10.1109/EuroSimE60745.2024.10491500

RT 
T1 <cTitle>2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Full-Field Through-Chip IR-Thermography-based Quality Testing & Failure Analysis on Electroplated Aluminium Interconnects for Cryogenic Applications in Ion-Trap Quantum Computers</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10491500&Exemplar=1&LAN=DE
				
A1 May, D.
A1 Wunderle, B.
A1 Cirulis, I.
A1 Braun, S.
A1 Zschenderlein, U.
A1 Heilmann, J.
A1 Pantou, R.
A1 Schacht, R.
A1 Rzepka, R.
A1 Ras, M. Abo
A1 Kurth, S.
A1 Kuhn, H.
YR 2024
SN 2833-8596
K1 Computers
K1 Quantum computing
K1 Three-dimensional displays
K1 Sensitivity
K1 Aluminum
K1 Quantum mechanics
K1 Silicon
K1 IR transient thermography
K1 failure analysis
K1 electroplated aluminium joints
K1 quantum computing
SP 1
OP 8
LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE60745.2024.10491500
DO https://doi.org/10.1109/EuroSimE60745.2024.10491500
SF ELIB - SuUB Bremen

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