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1 Ergebnisse
1
Numerical Study on the Correlation between Board-level Drop..:
, In:
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Nguyen, Hong-Hai
;
Lyu, Chengzhe
;
Meier, Karsten
. - p. 1-5 , 2024
Link:
https://doi.org/10.1109/EuroSimE60745.2024.10491520
RT T1 <cTitle>2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Numerical Study on the Correlation between Board-level Drop and Shock Tests for Chip-Scale Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10491520&Exemplar=1&LAN=DE A1 Nguyen, Hong-Hai A1 Lyu, Chengzhe A1 Meier, Karsten A1 Bock, Karlheinz YR 2024 SN 2833-8596 K1 Temperature measurement K1 Semiconductor device measurement K1 Electric shock K1 Resonant frequency K1 Manuals K1 Real-time systems K1 Soldering SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE60745.2024.10491520 DO https://doi.org/10.1109/EuroSimE60745.2024.10491520 SF ELIB - SuUB Bremen
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