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1 Ergebnisse
1
Warpage Optimization of Package Substrates Using Metamodels..:
, In:
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Porathur, Fredy John
;
Kamble, Vikram G
;
Stadler, Eduard
... - p. 1-9 , 2024
Link:
https://doi.org/10.1109/EuroSimE60745.2024.10491528
RT T1
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
: T1
Warpage Optimization of Package Substrates Using Metamodels - A Review
UL https://suche.suub.uni-bremen.de/peid=ieee-10491528&Exemplar=1&LAN=DE A1 Porathur, Fredy John A1 Kamble, Vikram G A1 Stadler, Eduard A1 Huber, Fabian A1 Gruber, Dieter P. A1 Fuchs, Peter Filipp YR 2024 SN 2833-8596 K1 Micromechanical devices K1 Geometry K1 Reviews K1 Neural networks K1 Thermal sensors K1 Microelectronics K1 Convolutional neural networks K1 metamodel K1 simulation K1 optical sensor packages K1 optimization K1 substrate warpage K1 DOE SP 1 OP 9 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE60745.2024.10491528 DO https://doi.org/10.1109/EuroSimE60745.2024.10491528 SF ELIB - SuUB Bremen
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