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1 Ergebnisse
1
Analysis of the Thermo-mechanical Performance of Double-Sid..:
, In:
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Singh, Bhanu Pratap
;
Ghahfarokhi, Shahriar Sarmast
;
Kostov, Konstantin
.. - p. 1-8 , 2024
Link:
https://doi.org/10.1109/EuroSimE60745.2024.10491556
RT T1 <cTitle>2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Analysis of the Thermo-mechanical Performance of Double-Sided Cooled Power Modules</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10491556&Exemplar=1&LAN=DE A1 Singh, Bhanu Pratap A1 Ghahfarokhi, Shahriar Sarmast A1 Kostov, Konstantin A1 Nee, Hans-Peter A1 Norrga, Staffan YR 2024 SN 2833-8596 K1 Thermal expansion K1 Thermomechanical processes K1 Multichip modules K1 Conductivity K1 Thermal conductivity K1 Market research K1 Steady-state K1 power module K1 finite element K1 double-sided cool K1 reliability SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE60745.2024.10491556 DO https://doi.org/10.1109/EuroSimE60745.2024.10491556 SF ELIB - SuUB Bremen
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