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1 Ergebnisse
1
Fatigue behavior of aluminum and copper metallization for S..:
, In:
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Losbichler, Daniel
;
Klingler, Markus
;
Orso, Steffen
. - p. 1-8 , 2024
Link:
https://doi.org/10.1109/EuroSimE60745.2024.10491567
RT T1 <cTitle>2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Fatigue behavior of aluminum and copper metallization for SiC during APC</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10491567&Exemplar=1&LAN=DE A1 Losbichler, Daniel A1 Klingler, Markus A1 Orso, Steffen A1 Wunderle, Bernhard YR 2024 SN 2833-8596 K1 Degradation K1 Metallization K1 Silicon carbide K1 Wires K1 Thermomechanical processes K1 Bending K1 Copper SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE60745.2024.10491567 DO https://doi.org/10.1109/EuroSimE60745.2024.10491567 SF ELIB - SuUB Bremen
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