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1 Ergebnisse
1
A Single-layer Photosensitive Polymer Material for Temporar..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Wang, Xuefan
;
Liu, Qiang
;
Wang, Fangcheng
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10491900
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>A Single-layer Photosensitive Polymer Material for Temporary Bonding and Laser Debonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10491900&Exemplar=1&LAN=DE A1 Wang, Xuefan A1 Liu, Qiang A1 Wang, Fangcheng A1 Dai, Wenxue A1 Li, Kang A1 Zhang, Guoping A1 Sun, Rong YR 2023 SN 2836-9734 K1 Wafer bonding K1 Laser stability K1 Laser ablation K1 Polymers K1 Nitrogen K1 Bonding K1 Atmospheric waves K1 Temporary bonding materials K1 Single-layer bonding K1 Photosensitive polymer materials K1 Thin wafer K1 Laser debonding SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10491900 DO https://doi.org/10.1109/ICEPT59018.2023.10491900 SF ELIB - SuUB Bremen
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