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1 Ergebnisse
1
A Comprehensive Study of Interface Damage at Cu/Polyimide I..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Zhou, Shilu
;
Zhong, Cheng
;
Shan, Liang
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10491916
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>A Comprehensive Study of Interface Damage at Cu/Polyimide Interface in Redistribution Layers of Fan-out Wafer Level Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10491916&Exemplar=1&LAN=DE A1 Zhou, Shilu A1 Zhong, Cheng A1 Shan, Liang A1 Zhang, Guoping A1 Lu, Jibao A1 Sun, Rong YR 2023 SN 2836-9734 K1 Thermal expansion K1 Temperature K1 Cooling K1 Switches K1 Curing K1 Transceivers K1 Wafer scale integration K1 Cu/polyimide K1 Redistribution Layer K1 Cohesive Zone Model SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10491916 DO https://doi.org/10.1109/ICEPT59018.2023.10491916 SF ELIB - SuUB Bremen
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