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1 Ergebnisse
1
Reliability Study of Two-Step Plasma-Activated Copper-Coppe..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Hu, Liangxing
;
Lim, Yu Dian
;
Zhong Lim, Michael Joo
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10491919
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Reliability Study of Two-Step Plasma-Activated Copper-Copper Direct Bonding in Ambient</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10491919&Exemplar=1&LAN=DE A1 Hu, Liangxing A1 Lim, Yu Dian A1 Zhong Lim, Michael Joo A1 Miao, Weiyang A1 Dinh, Van Quy A1 Xie, Zhen A1 Chen, Qimiao A1 Ju, Xin A1 Tan, Chuan Seng YR 2023 SN 2836-9734 K1 Life estimation K1 Humidity K1 Power electronics K1 Microelectronics K1 Reliability K1 Bonding K1 Plasma temperature K1 copper-copper direct bonding K1 plasma activation K1 ambient conditions K1 highly accelerated temperature and humidity stress test K1 reliability of copper-copper bonds SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10491919 DO https://doi.org/10.1109/ICEPT59018.2023.10491919 SF ELIB - SuUB Bremen
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