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1 Ergebnisse
1
Influences of bonding process parameters on mechanical prop..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Wang, Kefeng
;
Zhong, Han
;
Chen, Zehua
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10491930
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Influences of bonding process parameters on mechanical properties of the Micro-LED device</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10491930&Exemplar=1&LAN=DE A1 Wang, Kefeng A1 Zhong, Han A1 Chen, Zehua A1 Zhou, Haojie A1 Ji, Xiaoxiao A1 Lu, Xiuzhen A1 Yin, Luqiao A1 Zhang, Jianhua YR 2023 SN 2836-9734 K1 Temperature distribution K1 Deformation K1 Distance measurement K1 Finite element analysis K1 Flip-chip devices K1 Bonding K1 Surface treatment K1 flip-chip bonding K1 micro-led K1 process parameters K1 mechanical properties SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10491930 DO https://doi.org/10.1109/ICEPT59018.2023.10491930 SF ELIB - SuUB Bremen
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