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Electroless amorphous Ni-Cu-P deposit and the interaction b..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Xing, Jing ; Xiao, Siyuan ; Li, Xiaofu... - p. 1-5 , 2023
Link: https://doi.org/10.1109/ICEPT59018.2023.10491932