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1 Ergebnisse
1
Electrochemical Migration Mechanism of Cu@Ag Composite Pref..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Li, Ziao
;
Zhao, Weiwei
;
Shi, Runze
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10491934
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Electrochemical Migration Mechanism of Cu@Ag Composite Preforms by Electromagnetic Compaction for Power Electronics
UL https://suche.suub.uni-bremen.de/peid=ieee-10491934&Exemplar=1&LAN=DE A1 Li, Ziao A1 Zhao, Weiwei A1 Shi, Runze A1 Chen, Ziwen A1 Chen, Zhiwen A1 Liu, Li YR 2023 SN 2836-9734 K1 Resistance K1 Silver K1 Scanning electron microscopy K1 Powders K1 Preforms K1 Power electronics K1 Compaction K1 Cu@Ag core shell K1 Electromagnetic compaction K1 Electrochemical migration mechanism SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10491934 DO https://doi.org/10.1109/ICEPT59018.2023.10491934 SF ELIB - SuUB Bremen
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