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1 Ergebnisse
1
A novel approach to 3D stacking of power chips with hot-via..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Chang, Wenhan
;
Ye, Huijie
;
Lu, Qian
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10491956
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
A novel approach to 3D stacking of power chips with hot-via interconnections
UL https://suche.suub.uni-bremen.de/peid=ieee-10491956&Exemplar=1&LAN=DE A1 Chang, Wenhan A1 Ye, Huijie A1 Lu, Qian A1 Zhang, Jian A1 Wu, Qingmin A1 Cheng, Qifen A1 Xu, Rongqing A1 Xiang, Weiwei YR 2023 SN 2836-9734 K1 Solid modeling K1 Three-dimensional displays K1 Simulation K1 Fixtures K1 Stacking K1 Finite element analysis K1 Reliability K1 3D stacking K1 hot-via K1 fixture K1 TCB SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10491956 DO https://doi.org/10.1109/ICEPT59018.2023.10491956 SF ELIB - SuUB Bremen
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