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1 Ergebnisse
1
Warpage behavior of the flip chip package in underfill curi..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Fan, Yixuan
;
Peng, Liang
;
Zhang, Zhen'An
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10491970
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Warpage behavior of the flip chip package in underfill curing process: in situ characterization and numerical simulation
UL https://suche.suub.uni-bremen.de/peid=ieee-10491970&Exemplar=1&LAN=DE A1 Fan, Yixuan A1 Peng, Liang A1 Zhang, Zhen'An A1 Li, Gang A1 Zhao, Danning A1 Zhang, Zhenguo A1 Sun, Rong A1 Zhu, Pengli YR 2023 SN 2836-9734 K1 Correlation K1 Temperature K1 Deformation K1 Materials reliability K1 Curing K1 Flip-chip devices K1 Polymers K1 Flip chip package K1 Underfill K1 3D-Digital Image Correlation (DIC) K1 FEA SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10491970 DO https://doi.org/10.1109/ICEPT59018.2023.10491970 SF ELIB - SuUB Bremen
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