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1 Ergebnisse
1
The influence of pattern size on the profile and microstruc..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Liu, Jin-Hao
;
Gao, Li-Yin
;
Cui, Xian-Wei
.. - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10491975
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>The influence of pattern size on the profile and microstructure of electroplated copper pad, redistribution layer and via for advanced packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10491975&Exemplar=1&LAN=DE A1 Liu, Jin-Hao A1 Gao, Li-Yin A1 Cui, Xian-Wei A1 Wan, Yong-Qiang A1 Liu, Zhi-Quan YR 2023 SN 2836-9734 K1 Microscopy K1 Lasers K1 Thermal shock K1 Packaging K1 Electronic packaging thermal management K1 Thermal conductivity K1 Microstructure K1 electroplating K1 pads K1 redistributed layers (RDL) K1 vias K1 size effect SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10491975 DO https://doi.org/10.1109/ICEPT59018.2023.10491975 SF ELIB - SuUB Bremen
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