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1 Ergebnisse
1
Optimal design of the stress-buffering structure in MEMS re..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Xiaorui, Bie
;
Xingyin, Xiong
;
Zheng, Wang
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10491990
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Optimal design of the stress-buffering structure in MEMS resonant accelerometer package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10491990&Exemplar=1&LAN=DE A1 Xiaorui, Bie A1 Xingyin, Xiong A1 Zheng, Wang A1 Wuhao, Yang A1 Zhitian, Li A1 Xudong, Zou YR 2023 SN 2836-9734 K1 Accelerometers K1 Micromechanical devices K1 Temperature measurement K1 Temperature distribution K1 Resonant frequency K1 Electronic packaging thermal management K1 Stability analysis K1 MEMS resonant accelerometer K1 Frequency drift K1 Thermal stress K1 Stress buffering K1 Finite element method SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10491990 DO https://doi.org/10.1109/ICEPT59018.2023.10491990 SF ELIB - SuUB Bremen
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