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1 Ergebnisse
1
Characterization and modeling of interface delamination in ..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Zhu, Cheng
;
Yang, Wen
;
Chen, Danyang
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10491996
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Characterization and modeling of interface delamination in 3D stacked package with combination of experimental and CZM analysis</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10491996&Exemplar=1&LAN=DE A1 Zhu, Cheng A1 Yang, Wen A1 Chen, Danyang A1 Qin, Junjie A1 Wang, Zijian A1 Yang, Daoguo YR 2023 SN 2836-9734 K1 Analytical models K1 Solid modeling K1 Three-dimensional displays K1 Loading K1 Packaging K1 Structural beams K1 Delamination K1 Interface delamination K1 Chip and substrate K1 Mode I and Mode II K1 CZM K1 Crack initiation and propagation SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10491996 DO https://doi.org/10.1109/ICEPT59018.2023.10491996 SF ELIB - SuUB Bremen
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