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1 Ergebnisse
1
Research on Quality Control of Thermal Ultrasonic Wire Bond..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Cheng, Xiaoran
;
Ding, Zhimin
;
Duan, Chao
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492013
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Research on Quality Control of Thermal Ultrasonic Wire Bonding Based on PFMEA and SPC</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492013&Exemplar=1&LAN=DE A1 Cheng, Xiaoran A1 Ding, Zhimin A1 Duan, Chao A1 Wu, Zhaoxi A1 Wu, Yaning A1 Meng, Meng YR 2023 SN 2836-9734 K1 Wires K1 Process control K1 Quality control K1 Electronic packaging thermal management K1 Acoustics K1 Stability analysis K1 Thermal analysis K1 Thermal ultrasonic wire bonding K1 PFMEA K1 SPC SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492013 DO https://doi.org/10.1109/ICEPT59018.2023.10492013 SF ELIB - SuUB Bremen
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