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1 Ergebnisse
1
Simulation Application of Interconnected Structure of Micro..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Ye, Yunong
;
Liu, Jie
;
Wang, Haoyan
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492014
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Simulation Application of Interconnected Structure of Microsystems Based on Artificial Neural Network Technology</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492014&Exemplar=1&LAN=DE A1 Ye, Yunong A1 Liu, Jie A1 Wang, Haoyan A1 Li, Miao A1 Wang, Zhiqiang A1 Li, Wei YR 2023 SN 2836-9734 K1 Micromechanical devices K1 Training K1 Computational modeling K1 Software algorithms K1 Artificial neural networks K1 Numerical models K1 Finite element analysis K1 microsystem K1 interconnection K1 modeling SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492014 DO https://doi.org/10.1109/ICEPT59018.2023.10492014 SF ELIB - SuUB Bremen
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