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1 Ergebnisse
1
Prediction of bonding strength for sintered Ag/DBA joints b..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Zhao, Libo
;
Dai, Yanwei
;
Qin, Fei
. - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492024
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Prediction of bonding strength for sintered Ag/DBA joints based on cohesive zone model
UL https://suche.suub.uni-bremen.de/peid=ieee-10492024&Exemplar=1&LAN=DE A1 Zhao, Libo A1 Dai, Yanwei A1 Qin, Fei A1 Jia, Qiang YR 2023 SN 2836-9734 K1 Silver K1 Silicon carbide K1 Multichip modules K1 Predictive models K1 Stability analysis K1 Reliability K1 Bonding K1 SiC power module K1 Sintered silver K1 Metallized layers K1 Bond strength K1 Fracture surface K1 CZM SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492024 DO https://doi.org/10.1109/ICEPT59018.2023.10492024 SF ELIB - SuUB Bremen
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