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1 Ergebnisse
1
Optimization of stress and related parameters of BGA solder..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Li, Junjian
;
Huang, Chunyue
;
Li, Shuyi
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492027
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Optimization of stress and related parameters of BGA solder joint with void defect under torsional load</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492027&Exemplar=1&LAN=DE A1 Li, Junjian A1 Huang, Chunyue A1 Li, Shuyi A1 Yin, Shupei A1 Liu, Jiahua A1 Liu, Xianjia YR 2023 SN 2836-9734 K1 Analytical models K1 Welding K1 Data models K1 Structural engineering K1 Finite element analysis K1 Soldering K1 Stress K1 Ansys K1 BGA solder joints K1 Void defects K1 Orthogonal test method K1 Optimization analysis SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492027 DO https://doi.org/10.1109/ICEPT59018.2023.10492027 SF ELIB - SuUB Bremen
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